A Chinese infrastructure company has successfully raised $350 million in digital yuan for its new technology innovation bond. According to Shanghai Securities News, the Shandong Hi-Speed Group issued the “Shandong Hi-Speed Group Co., Ltd. 2024 Public Offering to Institutional Investors of Science and Technology Innovation Renewable Corporate Bonds (First Phase)” and listed the bond on The post Chinese Company Issues First $350 Million Tech Innovation Bond Raised in Digital Yuan appeared first on Cryptonews .
